Summary Sheet: Manufacturing Operations |
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| Advertiser Name | P Chappel Associates Inc | | Advertiser Type: | Not Specified |
| Classification: | Manufacturing Operations | | Subclassification: | |
| Country: | United States | | Location: | United States |
| Language: | English - United Kingdom (en-GB) | | Contact Name: | |
| Employment Type: | Permanent | | Workhours: | Not Specified |
Position: Electronics Packaging Design Engineer |
Description: We are seeking an experienced Electronics Packaging Design Engineer to join our team. In this role, you will lead the design of advanced packaging solutions including flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures. You'll collaborate with cross-functional teams and suppliers to deliver reliable, manufacturable, and cost-effective designs. Responsibilities: Design interconnects, substrate stack-ups, routing strategies, and package layouts. Verify designs against electrical, thermal, mechanical, and manufacturability requirements. Partner with suppliers and internal teams to align designs with process capabilities. Support failure analysis and root-cause investigations. Document design processes and lead reviews from concept to release. Mentor junior engineers and support packaging technology roadmaps. Qualifications: Bachelor's in Electrical Engineering, Materials Science, or related field. 8+ years in IC/electronic packaging design. Proficiency with Cadence Allegro or equivalent tools. Expertise in advanced packaging (2.5D/3D, interposers, HBM, fan-out WLP, wire bond, flip chip, stacked die, ceramic co-fire, encapsulated modules/BGAs). Strong knowledge of substrate technologies and manufacturing processes. Excellent problem-solving and communication skills. Preferred: Experience with OSATs/foundries, high-speed digital interfaces (PCIe, DDR, SerDes), package-level simulation tools, and defense packaging for extreme environments.
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